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I just finished going through this exercise and yes, it's really hard to unsolder. Whatever you do, do not pull, since it can remove traces and/or damage the board.


I followed the schematic on post #1,197 as to see which points could need more time: single signal points would require less time, while power carrying points (two or more pins with same signal together) will require more time (single points took about 5 seconds at 400 Deg, others took up to 15 seconds, must monitor to avoid burning the board). Select a nozzle that is just larger than the size of the pins. I also used rosin and resoldered more than once with a lower temperature melting wire (with lead, lead free requires higher temperature), kept the station tip and the area clean. Once the hole is clear of solder, I heated just the pins with the solder to dislodge them from the walls of the holes. Only once all the pins were free the waffle plate will come out.


I found out that it's best if you can get all the solder at the first go, partial would be left if you attempt extracting when not all the solder is molten, so patience is needed. I learned that too late in the game.


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